TBD

Moderator

EFECS will be lead by a professional moderator. More details will follow.

Kurt Sievers

President and Chief Executive Officer of NXP

Keynote speech

Kurt Sievers has served as president and chief executive officer of NXP since May 2020.

As a member of NXP’s executive management team since 2009, Kurt has been instrumental in leading the definition and implementation of NXP’s strategy for “secure connections for a smarter world.” Prior to being elected CEO, Kurt served as president of NXP and oversaw all of the company’s business lines. In 2019, Kurt led the successful acquisition of Marvell’s Wi-Fi Connectivity Business Unit, enabling NXP to deliver complete, scalable processing and connectivity solutions to customers across NXP’s focus end markets. In 2015, he played a key role in the merger of NXP and Freescale Semiconductor, which created one of the world’s leading semiconductor companies and a leader in automotive semiconductors and secure edge processing.

Kurt joined NXP in 1995, progressing through a series of sales and marketing, product definition and development, strategy and general management leadership positions across a broad number of market segments.

Pierre Barnabé

CEO of Soitec

Panel Session on the EU Chips Act/Chips JU

More information soon.

Jens-Knut Fabrowski

Executive Vice President of Automotive Electronics at Robert Bosch GmbH

Panel Session on the EU Chips Act/Chips JU

Jens Fabrowsky has been Executive Vice President Automotive Electronics of Robert Bosch GmbH since April 2012. Born in Esslingen, Germany, on August 13, 1968, he is married and has three children. He studied mechanical engineering and industrial engineering at the University of Stuttgart (Germany) and the Technical University of Munich (Germany).

Career stages in the Bosch Group

1999

Department Head with responsibility for assembly of hydraulic units at the Blaichach plant, Germany
Chassis Systems division

2000

Technical Plant Manager at the Rutesheim plant, Germany
Gasoline Systems division

2004

Plant Manager at the Eisenach plant, Germany
Gasoline Systems division

2007

Executive Vice President with responsibility for Manufacturing
Starter Motors and Generators division

2012

Executive Vice President with responsibility for Electronic Control Units as well as Manufacturing
Automotive Electronics division

2017

Executive Vice President with responsibility for the business field Semiconductor Components
Automotive Electronics division

Bart Noordam

Senior Vice President of Strategy and Presidents’ Office at ASML

Panel Session on the EU Chips Act/Chips JU

Bart, a former professor of physics and dean of the science faculty at the University of Amsterdam, McKinsey consultant and Auditor of Provinces, joined ASML in 2012.Close to his background he started at ASML as Vice President Research involved in pre-devolpment of new technologies for DUV and EUV products.

Few years later Bart was leading the System Integration cluster in Development and Engineering. System Integration is responsible for the introduction of new ASML Products to enable new generations (nodes) in the semiconductor production process by chipmakers such as Intel, TSMC and Samsung.

Since 2020 Bart is leading the Strategy and Presidents Office with teams in Strategy, New Business Developments, Capability Strategy, Corporate Marketing, Field Marketing, Geopolitical Affairs, ESG and the Presidential support organization. Bart supports BoM in its meetings and interactions.

Jean-Luc di Paola Galloni

Group Corporate Vice-President of Sustainable Development & External Affairs at Valeo, President of Inside Association

Panel Session on the EU Chips Act/Chips JU

Jean-Luc di Paola-Galloni joined Valeo in 2007 as CEO’s delegate and member of the Executive Committee, before becoming Group Corporate VP in charge of Sustainable Development and External Affairs in 2010.

Serving as Vice-Chairman since 2009 for the European Road Transport Research Advisory Council (ERTRAC), the main automotive technology platform on collaborative research of the EU Commission, Jean-Luc is also a member of the Board of its cPPP European Green Vehicle Initiative (EGVI).

In 2018 he was elected President of Inside Association (formarly known as Artemis-IA), the European association representing the embedded systems industry and research actors in the KDT Joint Undertaking for which he is the Chairman of the Private Members Board.

Additionally, he is representing the Valeo group in the Board of CLEPA (the European Association of Automotive Suppliers) since July 2018.

Jean Luc’s commitment to establish fair relationships between the automotive industry and international bodies, with a multi-stakeholder approach, is also reflected by his engagement as a member of the Corporate Partnership Board (CPB) of the International Transport Forum (ITF), the formal mechanism of the OECD and associated countries’ transport ministers to engage with the private sector.

Finally, he is also representing Valeo in the selection and investment committee of the Fonds Avenir Automobile (FAA) within the French state-owned Banque Publique d'Investissement (BPI).

Jean-Luc was previously advisor to the CEO of Gaz de France (2002 - 2004) and has research experience in the field of defense, international relations and strategic affairs since he has been a scholar of Harvard University, Ecole Normale Supérieure and Institut des Hautes Etudes de Défense Nationale

Luc van den Hove

President and CEO of imec

Panel Session on the EU Chips Act/Chips JU

Luc Van den hove is President and CEO of imec since July 1, 2009. Before he was executive vice president and chief operating officer. He joined imec in 1984, starting his research career in the field of silicide and interconnect technologies. Dr. Luc Van den hove has played a critical role in setting up the world’s largest partnership in semiconductor R&D at imec. Leading IC manufacturers, foundries, equipment, and material suppliers, fabless, fablite and system companies are gathered to jointly tackle the roadblocks for continued technology and system scaling, today targeting the 2nm node and beyond.

Luc Van den hove is a member of the Technology Strategy Committee of ASML and member of the board of Proximus. Under his leadership, imec received the IEEE Corporate Innovation Award in 2011 and the Semi sales marketing excellence award in 2018. Dr. Van den hove was elected as an international member of the United States National Academy of Engineering (NAE) in 2021. In April 2021, he was appointed chair of the SEMI Europe board.

He has authored or co-authored more than 200 publications and conference contributions.

Ralf Bornefeld

Senior Vice President of Power Semiconductors & Modules at Robert Bosch GmbH, Chair of KDT-JU Governing Board

Introduction on synergies with KDT

Ralf Bornefeld is Senior Vice President with responsibility for business line and engineering of Power Semiconductors & Modules at Bosch. He joined Bosch in November 2019.

Before he held various management positions at Infineon Technologies AG: senior director technology in frontend production from 2005-2008, senior director engineering of automotive sensors until 2011 and finally vice president and general manager business line automotive sensors.

Ralf started his career at Elmos Semiconductor in 1992 as a technology development engineer. Afterwards he took several management positions until end of 2004, mostly serving as vice president of R&D and eventually as vice president of business line microsystems.

Ralf Bornefeld was born in Schalksmuehle, Germany, in 1964. He graduated with a degree in Electrical Engineering from Technical University of Dortmund in 1992.

Colin Willcock

Chair of SNS-JU Governing Board, Chair of 6G-IA Governing Board

Syngergies on telecom applications

Colin is currently the chairman of the 6G Smart Networks and Services Industry Association (6G-IA) governing board (formally known as 5G Infrastructure Association). He is also the chairman of the European Smart Networks and Services Joint undertaking (SNS-JU) governing board. He has detailed knowledge and experience of the telecommunications industry having worked directly or indirectly with many of the major players over a 28-year period. The roles have included software developer, technical consultant, technical marketing, standardization and management. In addition to line manager roles, he has participated extensively in standardization activities at ETSI, ITU-T and 3GPP, including instrumental work in creating and developing the TTCN-3 testing language. Colin has also been very active in the European research ecosystem, including leading a number of award winning European projects such as TT-Medal, D-MINT and SEMAFOUR. Colin is currently head of Research Alliances at Nokia.

Armin Gräter

Chair of CCAM Association, Director of Digitalisation and Automated Driving at BMW Group

Synergies with Connected and Automated Mobility Applications

More information soon.

Casper Garos

Alternate Member of the IHI-JU Governing Board, Head of Public-Private Partnerships (PPPs) at Philips

Synergies with digital healthcare applications

Casper Garos is Head of Public-Private Partnerships (PPPs) at Philips. In this position he is responsible for enabling new innovations and collaborations through PPPs, involving a large network of companies, academic institutions and public authorities. He leads a team of experts that is involved in all relevant European funding programs. Casper is based in the Netherlands.

Casper studied at the University of Leiden, Netherlands and Dalhousie University, Canada, and holds a MA in law/international economics. In 1986 he joined Royal Philips as trade policy expert. Subsequently, he fulfilled global leadership functions in product management at Philips’ Components and Lighting divisions, in various locations in the Netherlands, Austria and the USA. Since 2007 Casper is active in PPPs in the healthcare domain.

Currently Casper is amongst others board member of the Eureka Cluster ITEA, member of the Eureka Industry Community Council, chair of the COCIR Research & Innovation Focus Group, alternate member of the IHI Governing Board, member of the Photonics21 Board of Stakeholders, member of the Business Europe Research & Technological Innovation Working Group, member of the EIBIR Scientific Board and Industry Panel, member of the Medical Delta Societal Advisory Committee and member of the Technology & Innovation Committee of VNO-NCW (Netherlands’ largest employers’ organization).

Linda Gesenhues

Programme Officer at EuroHPC

Synergies with High Performance Computing

Linda Gesenhues is a Programme Officer at the European High Performance Computing Joint Undertaking (EuroHPC JU). Linda has a longstanding interest in HPC and in particular has worked on research on High Performance Computing applications for computational mechanics and fluid dynamics.

Linda graduated from RWTH Aachen University with a Bachelor and Master in Mechanical Engineering. She then went on to complete her bi-national doctoral studies at the High Performance Computing Center at the Federal University of Rio de Janeiro in Brazil and the Chair for Computational Analysis of Technical Systems at RWTH Aachen University in Germany, researching on large scale finite element simulations of geophysical flows. She continued her career as a research group leader at the Chair for Computational Analysis of Technical Systems focusing on massively parallel simulations of phase boundaries during melting processes. In 2022, Linda joined the European High Performance Computing Joint Undertaking working mainly on Research&Innovation actions.

Paolo Azzoni

Secretary General of Inside Industry Association

ECS SRIA 2023

Paolo Azzoni is the Head of European Technology Programmes at EUROTECH Group and Secretary General of Inside Industry Association. He is responsible for planning and directing industrial research projects, investigating technologies beyond the state of the art in the areas of cyber-physical systems, intelligent systems, machine-to-machine, edge computing, internet of things and digitalization solutions. He has been actively involved in ECSEL initiative and previously in Artemis, since 2006, being member of the Artemis-IA Steering Board, of the Artemis-IA Presidium and the Chairman of the Working Group “From IoT to System of Systems”. He is the chairman of the ECS-SRIA 2023 and since January 2022 Secretary General of Inside Industry Association (former Artemis-IA). Before joining EUROTECH in 2005, he was involved in academic lecturing and research in the areas of hardware formal verification, hardware/software co-design and co-simulation, advanced hardware architectures and operating systems. He holds a Master Degree in Computer Science and a second Master Degree in Intelligent Systems.

Nadja Rohrbach

Programme Director at Xecs

Presenting at the Award session and the Upcoming Xecs calls and events on 25 November

With an academic background in biology and immunology, Nadja spent several years as a scientific officer for a member of the German Federal Parliament. Subsequently she joined the DLR Project Management Agency, initially focusing on Eureka and network projects, before becoming head of the Eurostars group.

In 2018, Nadja was seconded by the German government to the Eureka secretariat in Brussels, where she was appointed central coordinator for the new Eureka Clusters Programme and worked with various bodies to draft the first Multi-Annual and Annual Operational Plans. In September 2021, she joined AENEAS as the Xecs Programme Director in charge of the new Xecs Eureka Cluster, as well as the existing Penta and Euripides² Clusters.

Yves Gigase

Head of Programmes at KDT Joint Undertaking

Presenting the Upcoming KDT calls and events on 25 November

Dr. Yves Gigase is the Head of Programmes of the KDT Joint Undertaking, before which he held the same post for the ECSEL JU and the ENIAC JU. Before that he occupied manager and/or researcher positions in several companies active in optoelectronics, electronic consumer goods, consulting and telecommunication.

Yves Gigase holds an MSE in Applied physics and a PhD in Optoelectronics, both from the University of Gent. He completed two postdocs; one at the IBM Research Labs in Zurich and one at the Optical Computing Systems Centre at the University of Colorado, Boulder. He is an IEEE member.

Werner Steinhögl

European Commission

Presenting the upcoming Horizon Europe calls and events

More information will follow