Karen Coleman

Karen is a highly sought-after conference moderator who regularly moderates high-level events. Her experience as a BBC correspondent along with her background presenting live international radio shows and making television documentaries, have given her the skills to handle all sorts of conference moderating requirements.

Karen has moderated a significant array of events over the years including major international conferences for clients such as the EU Commission, European Parliament, European businesses, Finance and Insurance companies, journalism and environmental organisations, NGOs, etc. The topics she has covered have included Brexit, the Euro crisis, European Smart cities, European finance and economics, Global hunger, Maritime and Environmental policies, Food for the future, Climate Change, Research and Innovation, the Future of Europe, the Digital economy, Digital technologies for the 21st Century.

Kurt Sievers

Keynote speech

Kurt Sievers has served as president and chief executive officer of NXP since May 2020.

As a member of NXP’s executive management team since 2009, Kurt has been instrumental in leading the definition and implementation of NXP’s strategy for “secure connections for a smarter world.” Prior to being elected CEO, Kurt served as president of NXP and oversaw all of the company’s business lines. In 2019, Kurt led the successful acquisition of Marvell’s Wi-Fi Connectivity Business Unit, enabling NXP to deliver complete, scalable processing and connectivity solutions to customers across NXP’s focus end markets. In 2015, he played a key role in the merger of NXP and Freescale Semiconductor, which created one of the world’s leading semiconductor companies and a leader in automotive semiconductors and secure edge processing.

Kurt joined NXP in 1995, progressing through a series of sales and marketing, product definition and development, strategy and general management leadership positions across a broad number of market segments.

Bart Noordam

Panel Session on the EU Chips Act/Chips JU

Bart, a former professor of physics and dean of the science faculty at the University of Amsterdam, McKinsey consultant and Auditor of Provinces, joined ASML in 2012.Close to his background he started at ASML as Vice President Research involved in pre-devolpment of new technologies for DUV and EUV products.

Few years later Bart was leading the System Integration cluster in Development and Engineering. System Integration is responsible for the introduction of new ASML Products to enable new generations (nodes) in the semiconductor production process by chipmakers such as Intel, TSMC and Samsung.

Since 2020 Bart is leading the Strategy and Presidents Office with teams in Strategy, New Business Developments, Capability Strategy, Corporate Marketing, Field Marketing, Geopolitical Affairs, ESG and the Presidential support organization. Bart supports BoM in its meetings and interactions.

The EU Chips act/Chips JU panelsession

Jens Fabrowsky has been Executive Vice President Automotive Electronics of Robert Bosch GmbH since April 2012. Born in Esslingen, Germany, on August 13, 1968, he is married and has three children. He studied mechanical engineering and industrial engineering at the University of Stuttgart (Germany) and the Technical University of Munich (Germany).

Career stages in the Bosch Group

1999

Department Head with responsibility for assembly of hydraulic units at the Blaichach plant, Germany
Chassis Systems division

2000

Technical Plant Manager at the Rutesheim plant, Germany
Gasoline Systems division

2004

Plant Manager at the Eisenach plant, Germany
Gasoline Systems division

2007

Executive Vice President with responsibility for Manufacturing
Starter Motors and Generators division

2012

Executive Vice President with responsibility for Electronic Control Units as well as Manufacturing
Automotive Electronics division

2017

Executive Vice President with responsibility for the business field Semiconductor Components
Automotive Electronics division

The EU Chips act/Chips JU panelsession

Jean-Luc di Paola-Galloni joined Valeo in 2007 as CEO’s delegate and member of the Executive Committee, before becoming Group Corporate VP in charge of Sustainable Development and External Affairs in 2010.

Serving as Vice-Chairman since 2009 for the European Road Transport Research Advisory Council (ERTRAC), the main automotive technology platform on collaborative research of the EU Commission, Jean-Luc is also a member of the Board of its cPPP European Green Vehicle Initiative (EGVI).

In 2018 he was elected President of Inside Association (formarly known as Artemis-IA), the European association representing the embedded systems industry and research actors in the KDT Joint Undertaking for which he is the Chairman of the Private Members Board.

Additionally, he is representing the Valeo group in the Board of CLEPA (the European Association of Automotive Suppliers) since July 2018.

Jean Luc’s commitment to establish fair relationships between the automotive industry and international bodies, with a multi-stakeholder approach, is also reflected by his engagement as a member of the Corporate Partnership Board (CPB) of the International Transport Forum (ITF), the formal mechanism of the OECD and associated countries’ transport ministers to engage with the private sector.

Finally, he is also representing Valeo in the selection and investment committee of the Fonds Avenir Automobile (FAA) within the French state-owned Banque Publique d'Investissement (BPI).

Jean-Luc was previously advisor to the CEO of Gaz de France (2002 - 2004) and has research experience in the field of defense, international relations and strategic affairs since he has been a scholar of Harvard University, Ecole Normale Supérieure and Institut des Hautes Etudes de Défense Nationale

Ralf Bornefeld

Senior Vice President Power Semiconductors & Modules

Introduction on synergies with KDT

Ralf Bornefeld is Senior Vice President with responsibility for business line and engineering of Power Semiconductors & Modules at Bosch. He joined Bosch in November 2019.

Before he held various management positions at Infineon Technologies AG: senior director technology in frontend production from 2005-2008, senior director engineering of automotive sensors until 2011 and finally vice president and general manager business line automotive sensors.

Ralf started his career at Elmos Semiconductor in 1992 as a technology development engineer. Afterwards he took several management positions until end of 2004, mostly serving as vice president of R&D and eventually as vice president of business line microsystems.

Ralf Bornefeld was born in Schalksmuehle, Germany, in 1964. He graduated with a degree in Electrical Engineering from Technical University of Dortmund in 1992.

Colin Willcock

Syngergies on telecom applications

Colin is currently the chairman of the 6G Smart Networks and Services Industry Association (6G-IA) governing board (formally known as 5G Infrastructure Association). He is also the chairman of the European Smart Networks and Services Joint undertaking (SNS-JU) governing board. He has detailed knowledge and experience of the telecommunications industry having worked directly or indirectly with many of the major players over a 28-year period. The roles have included software developer, technical consultant, technical marketing, standardization and management. In addition to line manager roles, he has participated extensively in standardization activities at ETSI, ITU-T and 3GPP, including instrumental work in creating and developing the TTCN-3 testing language. Colin has also been very active in the European research ecosystem, including leading a number of award winning European projects such as TT-Medal, D-MINT and SEMAFOUR. Colin is currently head of Research Alliances at Nokia.

Patrick Boisseau

Synergies with digital healthcare applications

Paolo Azzoni

ECS SRIA 2023

Paolo Azzoni is the Head of European Technology Programmes at EUROTECH Group and Secretary General of Inside Industry Association. He is responsible for planning and directing industrial research projects, investigating technologies beyond the state of the art in the areas of cyber-physical systems, intelligent systems, machine-to-machine, edge computing, internet of things and digitalization solutions. He has been actively involved in ECSEL initiative and previously in Artemis, since 2006, being member of the Artemis-IA Steering Board, of the Artemis-IA Presidium and the Chairman of the Working Group “From IoT to System of Systems”. He is the chairman of the ECS-SRIA 2023 and since January 2022 Secretary General of Inside Industry Association (former Artemis-IA). Before joining EUROTECH in 2005, he was involved in academic lecturing and research in the areas of hardware formal verification, hardware/software co-design and co-simulation, advanced hardware architectures and operating systems. He holds a Master Degree in Computer Science and a second Master Degree in Intelligent Systems.