SCOTT - Secure Connected Trustable Things will provide comprehensive cost-efficient solutions of wireless, end-to-end secure, trustworthy connectivity and interoperability for various application domains to bridge the last mile to market implementation.
SEMI® connects more than 2,000 member companies and more than a quarter-million professionals worldwide to advance the science and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped its members grow, create new markets, and address common industry challenges together. More info: www.semi.org, and follow SEMI on LinkedIn and Twitter.
Competitive production in Europa will be leveraged by a well-focused approach of automation and smart production system integration in the domains of technologies, tools and methodologies which are complemented by innovations in the area of secure communication, knowledge management, automated decision-making, and smart (agile) production execution.
The project is the next in a chain of thematically connected pilot line projects which are associated with the development for the 12 and 10nm technology node. The objective is demonstration of 7nm IC technology integration in line with the industry needs on real devices at imec using innovative device architecture and comprising demonstration of a lithographic platform for EUV and immersion technology, advanced process and holistic metrology platforms, new materials and mask infrastructure.
SERENE-IoT project aims at contributing to develop high quality connected care services and diagnosis tools based on Advanced Smart Health-Care IoT devices, fully manufactured in Europe, enabling a good level of healthcare quality of service for patients remotely followed by professional caregivers, all at much lower cost than the traditional care provided today.
Silicon Europe is the European cluster alliance for innovative electronics & software technologies. It unites the strongest European clusters with access to the most advanced technologies and expertise in all fields of the electronics value chain. The "umbrella network" stands for a new, industry-led level of transnational collaboration. It transfers the national cluster concept of strong cooperation across organizational and institutional borders onto a European level. Together the cluster's ecosystem and their 2500 members working on science and industry represent more than 400,000 jobs.
The SilverStream project is developed to address the challenges associated with new technologies for future urban mobility. In particular, SilverStream will develop and demonstrate a radically new light and affordable vehicle concept (L-category) for the ageing population in congested European cities with scarce parking space. The SilverStream project combines both ergonomic concepts conceived for elderly people and advanced automotive technologies for better driveability and energy efficiency.
The SiNANO Institute is a non profit Association founding in 2008 aiming at establishing a durable EU Network of researchers in order to form a distributed Centre of Excellence in the nanoelectronic field. More than 1 200 scientific and technical staffs are working together in this field in the SINANO Institute. The 23 SINANO Institute members are renowned European research organisations and universities, from 12 european countries, in the field of nanoelectronics.
More than Moore, 3D high density, and System-in-Package technologies are prerequisites for compact system integration. SiPoB-3D aims at building up a design methodology for 3D integrated systems, which includes chip, package, and board domain. Both the design of a compact system and the understanding of the physics of the applied technologies and materials are focus. Data transfer between the three different domains is investigated. Target is a global optimum on chip, package and board level.
Smart 4 Europe supports the Smart Anything Everywhere initiative: expand the existing website to an innovation portal as central contact point, share best practice and experience, facilitate brokerage, coordinate communication, dissemination and exploitation activities as well as identify new technologies.
Smarter-SI provides access to small lot fabrication of Smart Systems: small volume - high value. The cooperative foundry is formed by RTOs, taking advantage of existing building blocks.
The oceans host substantial vital resources, namely oil and gas, whose industry will move to ever deeper waters, and where valuable renewable energy continues to be harvested. SWARMs will expand the use of robotic sea vehicles and facilitate the creation, planning and execution of maritime and offshore operations. This will make autonomous operations a viable option for new and existing industries, reducing operational costs, increasing the safety of tasks and help to expand the offshore sector.
The project is the next in a chain of thematically connected pilot line projects which are associated with the development for the 10 and 7nm technology node. The objective of the project is demonstration of 5nm patterning in line with the industry needs using innovative design and technology co-optimization, layout and device architecture exploration, and comprising demonstration of a lithographic platform for EUV technology, advanced process and holistic metrology platforms and new materials.
The objective is to develop and demonstrate lithographic, metrology, process and integration technologies enabling module integration for the 5nm node in the imec pilot line. This is planned with available EUV scanners optimized for mix and match with existing DUV scanners, and with system design and development of a new hyper NA EUV scanner to enable more single exposure patterning at 5nm. Module process steps are developed and evaluated morphologically and electrically using a test vehicle.
Today, the trend goes towards open CPS devices and we see a strong request for open platforms, which act as computational basis that can be extended during operation. The main goal of TAPPS is to extend and customize CPS devices with new 3rd party services and features in an Apps platform in an efficient, secure and trusted way. TAPPS goes beyond traditional solutions for safety, security and reliability in the CPS domain and offers a new approach towards extensibility of CPS platforms.
The TARANTO project targets to break the technological barriers to the development of the next BiCMOS technology platforms, allowing the improvement of the performance of the HBT (Heterojunction Bipolar Transistors) with a much higher level of integration. This new generation of transistors HBT will be a key factor to meet the needs of highspeed communications systems and high data rate required for the integration of heterogeneous intelligent systems as well as for intelligent mobility systems
The program THINGS2DO is focused on building the European Design & Development Ecosystem for FD-SOI-technology. This technology is uniquely positioned to take advantage of some very distinct strengths of the European Semiconductor Industry. This project will also demonstrate the benefir of FDSOI technology in application diomains such as Automotive, Aeronautic and IoT.
The objective is to develop and demonstrate a scalable, thermally-enabled 3D integrated optoelectronic platform that can meet the explosion in data traffic growth within ICT. The Thermally Integrated Smart Photonics Systems (TIPS) program will heterogeneously integrate micro-thermoelectric coolers (µTEC) and micro-fluidics (µFluidics) with optoelectronic devices in order to precisely control device temperature and thus device wavelength compared to commercially available discrete technology.
Innovative automotive systems require complex semiconductor devices currently only available in consumer grade quality. TRACE will develop and demonstrate methods, processes, tools to facilitate usage of CE components to be deployable more rapidly in the life-critical automotive domain.
The project acronyme stands for "TSV Hvm AND Yield optimization" TSV (Through Silicon Via) enables new chip architectures. Some challenges reside along the several steps of process to make TSV products cost efficient. The project aims at supporting the HVM ramp-up and improving the yield for manufacturing TSV products, at certain steps involving material handling, substrates logistics and temporary bonding.
Watify is a project funded by DG GROW which aims at raising the awareness among traditional smes of the importance and benefits of digitization and technological transformation around Europe. It specifically targets SMEs, notably in manufacturing, healthcare, finance and creative industries as well as mechanical engineering, construction, tourism, retail and agro-food, that can drive economic and/or social value by creating and using novel digital and advanced technologies.
The main objective is to establish a Pilot Line in STMicroelectronics Crolles and SOITEC Bernin to promote and sustain the FD-SOI technologies in Europe for the next years. This pilot line will offer an optimized Power-Performance-Area-Cost (PPAC) trade-off for FD-SOI technology platform based on Fully Depleted (FD) devices built on advanced Silicon On Insulator (SOI) substrate.
Technology scaling has enabled RF-CMOS circuits to operate in the mm-wave frequency range (30 to 300GHz) where large bandwidths are available. These bandwidths are exploited in radar applications (automotive at 77GHz) and in high data rate wireless communications (point-2-point link, new 5G radio interface). It also enables a new kind of wireline communication for short to medium distances: at mm-Wave frequencies, the “wire” can be a low-cost and low-weight plastic fiber or hollow tube
The aim is to develop reliable technology bricks for efficient and cost-effective applications addressing market segments where Europe is a recognized global leader as well as automotive, avionics, and railway, doing it by designing and prototyping on SiC based highly integrated power converters, bringing together the vertical value chain (e.g. packaging producers, passive component producers and the power converter producers), the final users and the academic entities .
WssTP is the recognized voice and promotor of water-related RTD and innovation in Europe. It is recognized by the EC as industry-led European Technology Platform for the Water The mission of WssTP is to: Improve coordination and collaboration in the water sector and water using sectors; Enhance performance of the European water sector and water using sectors; Contribute to solving societal challenges through RTD&I. WsstP membership covers the full value chain of the water sector.