Exhibition

Projects results and project proposals

EFECS2017-exhibition


EFECS will feature an exhibition that includes:

  • running R&D&I projects
    Dissemination of the project's innovation and progress
  • new project ideas
    Showing the technological challenges that are still to be faced, and networking with potential consortium partners
  • affiliated organisations
    Associations, alliances, ETPs and similar groupings that represent companies/institutes/universities with ECS R&D&I activities in Europe
  • the organisers of the event
    Showing their activities in the area of Embedded Components and Systems
  • speakers corner
    Giving opportunities for selected organisations in the field to report on their activities

Speakers corner

Presentation sessions at the EFECS exhibition

When Title Speaker Subject
20 Nov @ 12:20-12:40 Eco-System electronics Eco-System electronics Information will follow
20 Nov @ 12:40-13:00 How the CSA Industry 4.E help Industry4.E related projects and programmes achieve their full synergistic potential CSA Industry4.E consortium Outlining how the Coordination Support Action (CSA) will support and facilitate the goals of the Industry4.E Lighthouse Initiative through proactive actions designed to promote an environment in which projects and stakeholders can more readily network, interact and cooperate. By identifying and capitalising on complementary opportunities in strategic planning, networking and coordination between initiatives across Europe, this CSA will help Industry4.E related projects and programmes achieve their full synergistic potential. Additionally, by improving standardisation, dissemination, public awareness and communications, the CSA will help raise the profile of Industry4.E issues and so create a culture in which the 4th Industrial Revolution may thrive.
20 Nov @ 15:10-15:30 Interoperability Coordination Forum (ICF) ICF The increasing connectivity and integration further drives the importance of interoperability, for development environments and operational phases; many projects and efforts will need interoperability in one way and or another. In order to avoid recreating the wheel too often, it becomes essential to disseminate what has been achieved so far and stimulate critical mass efforts that build upon and leverage useful existing results and standards.
21 Nov @ 10:30-10:50 Democratizing robotics integration SAP

There is a new generation of robots, so-called service robots or “cobots”. They are human safe and intelligent, they can work side-by-side with humans and they cost about a quarter of what traditional robots cost. This makes them interesting to SMEs and to environment with one-off tasks.

Yet, programming and integrating them remains expensive. This is the problem SAP addresses jointly with a major partner.  There will be a Robotics cloud platform released that makes these robots smart, providing cartography and artificial intelligence, effectively providing spatial intelligence, recognition of 4D workspaces and objects. The effort provides plug-and-play with SAP applications. Independent from a given robot manufacturer, 3rd party developers can deploy the very same software container to any robot (E.g., for route optimization). This makes robot deployment and access to machine learning, cartography, and many other services incredibly inexpensive and easy for users in industry and research.

21 Nov @ 10:50-11:10 European Network on High Performance and Embedded Architecture and Compilation HiPEAC HiPEAC was created in 2004, and has since then supported the European Computing Community with training, talent search, roadmapping, networking. HiPEAC currently prepares the European Computing Community for the transition to Horizon Europe with its focus on innovation and on sustainability. The session will present HiPEAC, and the benefits it offers for the ECSEL community.
21 Nov @ 13:05-13:25 Silicon Europe - your gateway to innovative SMEs Silicon Europe Silicon Europe unites the strongest European clusters in an alliance with access to the most advanced technologies and expertise in all fields of the electronics and software value chain. Silicon Europe is the brand under which the leading European electronics and digitization clusters collaborate to represent, support and promote the companies and organizations of their regional business networks at European and global levels. Silicon Europe acts as an intermediary between all the relevant partners from research and academia, public authorities and industry. Twelve renowned European clusters have joined forces to support Europe’s goal to be the world’s leading center for innovative electronics & software technologies.
22 Nov @ 10:30-10:50 System Design and Heterogeneous Integration Politecnico di Torino Presentation of NEREID Roadmap on System Design and Heterogeneous Integration. Description of the new application-driven approach used for mapping system level requests and future needs for the design and implemenation of Electronic Systems and Applications./td>
22 Nov @ 13:00-13:20 Smart Energy for power applications and autonomous IoT systems CEA Presentation of the NEREID Roadmap for Energy related components and systems, from power electronics to autonomous sensing and energy harvesting. The technology forecast generated by a panel of experts presents the evolution of components, compares competing technologies and makes predictions for the coming years. A brief comparison of other roadmaps as well as an overview of the driving factors for implementation will provide context for discussion.
22 Nov @ 13:20-13:40 New Paradigms and Technologies for edge computing in future AI applications Grenoble INP - CNRS Presentation of NEREID Roadmap for edge computing including: i) Low power/high performance Nanoscale FET, using ULP design, Nanowire, Ultimate FET architecture, ii) Emerging devices and alternative information processing paradigms,like Small Slope Switches for very low power operation, novel computing approaches (as Neuromorphic, Quantum, Bio-Inspired) for big data and/or ultra low power, Spintronics in interconnects and signal processing to realise ultra low power, compact and fast technology.

Exhibitors list

The following organisations and projects will be represented at the EFECS exhibition. Click on a name to read more details.

Organisers:

1. AENEAS

1. ARTEMIS-IA

1. ECSEL-JU

1. EPoSS

1. European Commission

1. EUREKA


Affiliations:

79. AIOTI

74. Digital Sweden

73. ETPIS

75. EUREKA ICT Clusters

77. HiPEAC

78. SAP SE

80. SEMI Europe

82. Silicon Europe

81. SiNANO Institute - NEREID

76. Textile-ETP - CeNTI


SMEs:

4. AlphaSIP

3. IMA

Projects:

52. 3Ccar

58. 5G_GaN2

21. AMASS

32. Anti-SUPERBugs

22. ASCENT

27. ASTONISH

52. AutoDrive

42. Bonseyes

19. CAPID

10.CISTERN

60. CITCOM

18. CogniWin

54. COMPOSITION

8. CONNECT

41. CosmoDU

45. COSMOS

44. CSA Industry4.E

16. DEIS

39. DIATOMIC

26. DISPERSE

25. dReDBox

62. E450LMDAP

50. EAST

48. ENABLE-S3

22. EnABLES

49. ENSO

35. EPI

31. ESAIRQ

65. EuroPAT-MASIP

23. EUROPRACTICE

34. FITOPTIVIS

13. H2O

37. HADES

53. HiPERFORM

2. Ideal-ist

43. iDev40

18. InovWine

68. InSCOPE

72. inSSight

66. IoSense

56. Lighthouse Industry4.E

55. Lighthouse Mobility.E

36. Megam@rt2

67. MICROPRINCE

62. More Moore

15. MUSIC

28. Nanonets2Sense

38. NeuRAM3

12. NexGen

30. NOBEL

59. OCEAN12/ Reference

63. PRIME

52. PRYSTINE

70. R2power300

71. R3-PowerUP

46. SafeCOP

47. SAFEPOWER

57. SAM3

17. SCOTT

7. SDK4ED

14. SECREDAS

62. SeNaTe

20. SENSATION

29. SERENE-IoT

11. SILENSE

24. SiPoB-3D

40. Smart Anything Everywhere

72. SSI Trademark

61. SUPERAID7

9. TagItSmart

62. TAKE5

62. TAKEMI5

51. TRACE

69. TSV-Handy

33. ULIMPIA

64. WAKeMeUP

Floorplan

EFECS 2018 Exhibition floorplan

Floorplan 2018