Projects results and project proposals

EFECS will feature an exhibition that includes:

  • running R&D&I projects - dissemination of the project's innovation and progress
  • new project ideas - showing the technological challenges that are still to be faced, and networking with potential consortium partners
  • affiliated organisations - associations, alliances, ETPs and similar groupings that represent companies/institutes/universities with ECS R&D&I activities in Europe
  • the organisers of the event - showing their activities in the area of Embedded Components and Systems
  • speakers corner - giving opportunities for selected organisations in the field to report on their activities

The call for exhibition for the premiere edition of EFECS is closed and has resulted in a full exhibition. Details on the exhibitors can be found below.
Note: it is no longer possible to apply for booth space.


        Exhibitor details

Speaker corner

Speeches in the EFECS 2017 exhibition hall

During this three day event, multiple sessions are organised in the speakers corner in Grand Hall 2. Below an overview:

Speaker corner programme

Day 1 - 5 December
15.15 - 15.45 Multi Sensor Platform for Smart Building Management FP7 project MSP (www.multisensorplatform.eu) finished end of April 2017 and presents its results during a speakers corner session at EFCS.
Day 2 - 6 December
10.30 - 11.00 "Smart Systems Integrated" Trademark Smart Systems Integrated®" trademark as a cornerstone will identify the new products and prototypes based on Smart Systems Integration thus improving visibility, awareness, economic value and the proper “brand” positioning in the market.
15.40 - 16.50 AENEAS NEREID mid term Roadmap

NEREID is a H2020-CSA project entitled “NanoElectronics Roadmap for Europe: Identification and Dissemination”. Dedicated to map the future of European Nanoelectronics and has recently released a first version of its roadmap (available at https://www.nereid-h2020.eu/roadmap) which will be summarized exclusively at EFECS.

Day 3 - 7 December
10.45 - 11.30 Silicon Europe

Have you ever partnered with Innovative Clusters? Silicon Europe is the European cluster alliance for innovative electronics & software technologies. Together, the Alliance represents 2,500 science and industry members with a very high number of SMEs. Come and stop by at our speaker corner to discover and discuss collaboration opportunities with our network.

Exhibitors list

The following organisations and projects will be represented at the EFECS exhibition:


  • AENEAS (1)
  • ARTEMIS-IA (2)
  • ECSEL-JU (3)
  • EPoSS (4)
  • European Commission (5)


  • ConXEPT (43)
  • EFFRA (44)
  • EPSI (46)
  • HiPEAC (45)
  • Platforms4CPS (48)
  • SEMI Europe (42)
  • Silicon Europe (41)
  • SINANO (39)
  • WssTP (47)


  • 3Ccar (62)
  • 3DFF (6)
  • ADMONT (11)
  • AutoDrive (62)
  • CAT120 CISTERN (7)
  • CONNECT (52)
  • connectedautomateddriving.eu (63)
  • CORTIF (58)
  • CosmoDU (26)
  • Delphi4LED (51)
  • DEWI (59)
  • DISPERSE (36)
  • E450LMDAP (12)
  • EAST (57)
  • EmPower (53)
  • ENABLE-S3 (31)
  • eRamp (50)
  • EUROPRACTICE 2016 (10)
  • FITNESS (56)
  • GateOne (30)
  • H2O (69)
  • HADES (27)
  • Hyb-Man (32)
  • INSPEX (19)
  • inSSIght (25)
  • IoSense (13)
  • LOMID (67)
  • MIRS (18)
  • MIRTIC (49)
  • MobiTrust (70)
  • Nanonets2Sense (29)
  • NEMADE (38)
  • NexGen (37)
  • PANACHE (60)
  • PowerBase (14)
  • PRIME (22)
  • PRODRIVE (64)
  • REFERENCE (23)
  • RESIST (21)
  • SAM3 (8)
  • SCOTT (59)
  • Semi40 (33)
  • SENATE (12)
  • SERENE_IoT (35)
  • Silverstream (65)
  • SiPoB-3D (20)
  • Smart4Europe (34)
  • Smarter-SI (34)
  • SWARMs (54)
  • TAKE5 (12)
  • TAKEMI5 (12)
  • TAPPS (68)
  • TARANTO (15)
  • Things2Do (17)
  • TIPS (28)
  • TRACE (66)
  • TSV HANDY (9)
  • WATIFY (31)
  • WiCon (55)
  • WInSiC4AP (24)


EFECS 2017 Exhibition floorplan


Exhibitors details


3Ccar project provides highly integrated ECS Components for Complexity Control in thereby affordable electrified cars. The new semiconductors for Complexity management (Control, reduction) offers the next level of energy efficiency in transportation systems.


By means of flexible microfluidics and electronics combination the 3DFF brings three different platforms which correspond to different market needs. A quantitative portable drug-of-abuse detection deveice for roadside controls, a flexible patch based on polymer and piezoelectric technology for cardiac rhythm monitoring and flexible microfluidic patches for morphine determination in sweat (morphine concentration assessment in patients submitted to pain treatments in the clinic).


ADMONT will put in place a multi-KET (“Key Enabling Technology”) pilot line that contributes to the development of a vivid and competitive ecosystem and ECS industry with production in Europe, thereby bridging the gap between research, exploitation, industrial development, and smart system integration and creating economic and employment growth in the EU.


AENEAS is one of the organisers of EFECS. Read more

ARTEMIS Industry Association

ARTEMIS Industry Association is one of the organisers of EFECS. Read more


AutoDrive project advances fail-aware, fail-safe, and fail-operational electronic components, systems, and architectures for highly and fully automated driving to make future mobility safer, affordable, and end-user acceptable.


Research technologies for next genereation CMOS image sensors in 3 application domains. Image sensor research focus: • Better pixels (noise, dynamic range, temp sensing); • More pixels (higher spatial and temporal resolutions); and • Sensor related processing. Application: • Digital Lifestyle: broadcast & entertainment; • High-end Security • Multi-spectral imaging for food sorting • Proto CMOS sensors. For each application domain will be demonstrated together with the sensor related processing.


CONNECT - Innovative smart components, modules and appliances for a truly connected, efficient and secure smart grid. CONNECT aims to research, design, develop and showcase novel solutions for efficient and secure devices and components of the future smart grid, in order to reduce the peak power demand by at least a factor of two. The solutions will include techniques for the reduction of power fluctuations of the grid over time and for reduction of power consumption and losses.


The European Commission places a high priority on the deployment of automated road transport. It has set up two projects SCOUT (Safe and connected automation in road transport) and CARTRE (Coordination of automated road transport deployment for Europe) that work together with a broad range of international stakeholders to ensure that these technologies are deployed in a coordinated and harmonised manner, which will accelerate the implementation of safe and connected automated driving in Europe.


ConXEPT is the European consumer goods cross ETP aiming at maintaining and expanding the existing European-wide network: ? Creating and maintaining mutual awareness and facilitating contacts, building trust, ? Collecting and generating data and knowledge valuable for the entire community at EU level, ? Encouraging and organising knowledge exchange and other forms of community interaction, ? Extension of the community to other Consumer Goods sectors, ? Joint priority-setting and research and innovation roadmap continuous monitoring and review.


CORTIF targets the concurrent use of radio spectrum by multiple applications without detrimental mutual interference. I applies both at the application level (same location) and technology level (same PCB).


CosmoDU is a bi-national (DE & NL) PENTA project and will provide the hardware for the next generation industrial drives for Industry 4.0. It will integrate power electronics, sensors, signal processing, secure communication, control and health monitoring and self-learning in the motor housing. The focus of CosmoDU is a modular hardware for the integration of MEMS, sensors, WBG power and control electronics modules with advanced cooling into the motor for improved reliability and performance.


The main objective of Delphi4LED is to develop a standardized method to create multi-domain LED based design and simulation tools for the solid-state lighting industry


DEWI provides key solutions for wireless seamless connectivity and interoperability in smart cities and infrastructures, by considering everyday physical environments of cítizens in buildings, cars, trains and aeroplanes.


DISPERSE will optimize the workflow for MRI scanning of patients with multiple implants by developing electronics for spatially distributed sensor and transducer arrays. The innovation efforts exploit synergies between the health, space and smart city domains.


The overall goal of the E450LMDAP project is to develop 300 mm lithography and 300/450 mm metrology modules and tools and to initiate distributed pilot line activities over the lithography and metrology tool platform eco system. The pilot line activities will complement the activities from the already initiated ENIAC JU E450EDL project. In addition, also early 10nm node advanced patterning process development at the IMEC’s pilot line will be part of the project.


EAST (smart Everything everywhere Access to content through Small cells Technologies) is developing enablers and facilitators for 5G Small cells mobile networks up to 6 GHz. To achieve the ambitious goals, major steps have to be taken at the system/design level (novel transmitter architectures), at the technology level (new silicon processes and packaging solutions), as well as in the development of characterization and modelling tools.

ECSEL Joint Undertaking

ECSEL Joint Undertaking is one of the organisers of EFECS. Read more


The European Factories of the Future Research Association (EFFRA) is a non-for-profit, Industry-driven association promoting the development of new and innovative production technologies. It is the official representative of the private side in the 'Factories of the Future' public-private partnership.


EmPower has a clear goal to develop an innovative packaging concept for high-power modules for e-mobility and industrial applications. This concept is based on chip embedding technology for thin IGBTs and diodes and an innovative double-sided wafer plating process and equipment for thin wafers. The radical innovation of the concept lies on double-sided cooling, vertical current and heat flow in order to drastically improve heat dissipation and the thermal impedance of the embedded power cores.


ENABLE-S3 is a large industry-driven EU-project with 71 partners in 16 countries that aspires to substitute today’s cost-intensive validation and verification efforts for highly automated and autonomous systems by more advanced and efficient methods. The project aims to develop novel testing methodologies and technologies that will be applicable across 6 industrial domains (Automotive, Aerospace, Rail, Maritime, Health, Farming).


EPoSS is one of the organisers of EFECS. Read more


EPSI is a networking organization that focuses on innovation in the area of physical activity related to sport, leisure and health in Europe. EPSI strives for a more innovation-friendly environment for the EU’s sports industry in order to stimulate technological innovation and to set up innovative technology business.


eRamp was successfully closed May 31, 2017. Over 3 years, 26 partners have explored innovative electronics components for using energy even more efficiently. Focus was on the rapid introduction of new production technologies, such as packaging technologies for energy-saving chips. The eRamp project covered the entire power electronics value chain, from generation and transmission all the way to consumption. Infineon Technologies Dresden was coordinator of the project.


Network of over 40 countries that support and finance, through public and private partnerships, international R&D projects. EUREKA is a leading open platform for international cooperation in innovation, creating additional turnover and jobs and supporting the internationalization of businesses with innovative ideas. Collaboration is open to all technologies, but dedicated ICT Clusters like EUREKA PENTA are focusing on Electronic Components and Systems.
www.eurekanetwork.org | www.penta-eureka.eu

European Commission

The European Commission is one of the organisers of EFECS. Read more


The objectives of the EUROPRACTICE service are offering access to CAD tools for training and research, and access to advanced IC and More-than-Moore technologies for prototyping. As a broker, EUROPRACTICE negotiates low cost conditions with the most popular industry-standard CAD vendors and low-cost MPW runs at the most important foundries (both in Europe and abroad) for educational use and non-commercial research within 650 European Academia.


FITNESS aims at preparing the future of Professional Mobile Radio (PMR) in Europe and in the world. It paves the way towards high performance PMR based on Long-Term Evolution (LTE) and new functionalities requested by mission critical markets, while preserving backwards compatibility with existing Narrow Band PMR systems such as TETRAPOL, TETRA (both TETRA1 and TETRA2) and P25.


Gateone-project is a co-investment program of demonstrators. The Smart Anything Everywhere Innovation Action supports SMEs by advanced state of the art technologies selected for their differentiation, IP and maturity. Our offer is to work with SMEs to consolidate a business case and develop the necessary demonstration for a “hands-on” experience of the technology. By now gateone-project has funded 44 demonstrators.


The purpose of the H2O project, capitalizing on former results from the Catrene eGo project, is to develop the requested architecture to put the human in control of the smart objects surrounding, put on or in him, so as to develop a human centric and privacy ensuring security architecture to support the rapidly emerging Wearable computing and IoT markets. The project will investigate the human to object interactions in different application areas of the smart city domain


HADES project aims at providing a hierarchy-aware smart and secure embedded test infrastructure for dependability and performance enhancement of integrated systems. In order to achieve this ambition goal, HADES will move forward from the classic design and post-silicon fabrication test approach to a new, efficient, scalable and low-cost on-line paradigm. HADES outcomes will allow creating added value at system and user levels.


HiPEAC is a H2020 Coordination an support action. HiPEAC stand for European Network on High Performance and Embedded Architecture and Compilation. HiPEAC's mission is to steer and increase the European research in the area of high-performance and embedded computing systems, and stimulate cooperation between a) academia and industry and b) computer architects and tool builders.


In the project “Hyb-Man - Hybrid 3D Manufacturing of Smart Systems”, 11 parties from Germany and The Netherlands cooperate to develop hybrid 3D manufacturing methods to enable flexible first time right production of smart systems for lighting and automotive products. Hyb-Man exploits the combination of additive manufacturing (3D printing) and 3D integration of assembly and electronic parts. In-line testing and quality monitoring will be an integral part of the production chain.


INSPEX makes obstacle detection currently available in Automotive as a personal portable/wearable multi-sensor, miniaturised, low power system. INSPEX system will detect in real-time obstacles in the user’s 3D surroundings, localise them and raise alarms. INSPEX system will operate under various environmental conditions, in indoor and outdoor, with static and mobile obstacles. Demonstration of the system capabilities will be made to improve navigation for the Visually Impaired and Blind people.


inSSIght supports and complements R&I activities in Smart Systems Integration (SSI) by structuring industrial cooperation and facilitating end-user adoption of Smart Systems. inSSIght promotes know-how, expertise and technological solutions in SSI, supports the community, as represented by EPoSS, in the successful integration of Smart Systems in a broader spectrum of products and applications, and opens new market opportunities for SSI by responding to the needs of the demand side.


IoSense is increasing the pilot production capacity and improving time-to-market for innovative microelectronics by establishing three fully connected semiconductor pilot lines in Europe networking with existing highly specialized manufacturing lines. Focus is the availability of innovative, competitive sensors and sensor systems for applications in Smart Mobility, Society, Energy, Health and Production. Infineon Technologies Dresden is coordinator of the project


Within LOMID, flexible OLED microdisplays of exceptionally large area (13×21 mm) with a screen diagonal of 24.9 mm will be manufactured at challenging high yields (>60%). This will be achieved by developing a robust silicon-based chip design enabling high resolution (1200×1920 (WUXGA) with pixel sizes of 11×11 µm for a pixel density of 2300 ppi) and highly reliable manufacturing of the backplane. Low-cost processes & applications for VR and to aid people with impaired vision will be developed.


Infrared thermal sensors suffer today from expensive optical elements and packaging solutions, which impede their entry to high-volume applications. The primary goal of the MIRS project is to develop a generic innovative technology platform in order to reduce the cost of infrared sensing systems by extreme miniaturization, with the final objective to enable low-cost mass manufacturing for emerging high volume infrared detector markets like smart lighting, mobile devices and medical & health.


The MIRTIC project goal is to respond to a market expectation by developing and providing a new type of affordable low resolution infrared sensor. This new line of IR sensors is designed to fill an unmet need in applications seeking to achieve maximum efficiency in the everyday use of energy, for example heating or lighting systems. Existing single-element IR sensors (pyroelectric sensors), like those used in buildings to detect motion, do not have enough pixel number to provide required data.


The objective of the MobiTrust project is to develop a complete framework (HW/SW embedded bricks, remote credential life-cycle management tools, judiciary-proof forensics tools) aimed at enhancing the security and privacy protection of mobile platforms such as smart-phones or Tablets. The project focus will be on Android kernel technology. Complete mobile platforms based on off-the shelf commercial platforms and integrating the project results will be demonstrated at the end of project


Nanonets2Sense (H2020/ICT/RIA n° 688329) proposes a new technological building block allowing biosensors to be integrated at low cost above CMOS, with a 3D integration scheme. By using random networks of nanowires, called nanonets, as sensing material, our integration scheme retains the advantages of nanowires properties without the associated technological burden. This generic approach can be adapted to a variety of nanowires and target molecules and fits multiplex detection schemes.


A new and less expensive generation of X-ray detectors for mammography was be developed using butted CMOS tiles from Teledyne DALSA combined with structured CsI scintillators from Scint-X. This unique combination resulted in higher image quality at lower X-ray dose, and is suitable for screening, biopsy and tomosynthesis. New minimal breast compression technologies from SigmaScreening in combination with an extremely small chest wall distance resulted in reduced patient pain.


The Project Next Generation of Body Monitoring (NexGen), targets to develop key micro-electronic technologies and components for future mobile/wearable health care systems. The demos are intended for a permanent, mobile, autarkic monitoring of body functions using multi parameter biosensors, secure communication networks and energy efficient nano-electronics in the health care environment based on a heterogeneous integration platform, dedicated to medical applications.


The PANACHE project objective is to set-up a pilot line for embedded Flash technology design and manufacturing platform for the prototyping of innovative µcontrollers in Europe. The current 40nm technology platform as well as the already defined 55nm technology platform will be developed and consolidated in order to build a solid manufacturing platform on these technology nodes.


The Platforms4CPS (www.platforms4cps.eu) project is a 24-month H2020 coordination and support action in the area of Smart Cyber-Physical Systems. In addition to Platforms4CPS the following H2020 CPS projects will be presented: • Bonseyes (www.bonseyes.com) • DE IS (www.deis-project.eu) • CPSwarm (www.cpswarm.eu) • CERBERO (www.cerbero-h2020.eu).


PowerBase “Enhanced substrates and GaN pilot lines enabling compact power applications” aims to expand the limits in current power semiconductor technologies with focus on setting up a qualified wide band gap GaN technology pilot line, expanding the limits of today’s silicon based substrate materials for power semiconductors, improving manufacturing efficiency through automation, setting up a GaN compatible chip embedding pilot line and demonstrate in leading compact power application domains.


PRIME will develop and demonstrate the key building blocks of IoT ULP systems. This will include development of high performance, energy efficient and cost effective technology platform, flexible design ecosystem, changes in architectural and power management to reduced energy consumption, security blocks based on PUF and finally the System of Chip and System in Package memory banks and processing implementations for IoT sensor node systems.


PRODRIVE- Induistrialization of high performance in-wheel propulsion for SUVs. PRODRIVE is solving the key need of EV manufacturers – bringing them tested, certified and industrialized high-performance and cost-effective in-wheel propulsion for existing platforms and new vehicle concepts. The project is combining advanced in-wheel motors with 1500 Nm per wheel and andvanced electronic control.


REFERENCE project aims to leverage a European leading edge Radio Frequency (RF) ecosystem based on RF Silicon On Insulator (SOI) disruptive technology, perceived as the most promising to address performance, cost and integration needs for RF Front End Modules (FEMs). The project brings concrete solutions from engineered substrates, components, design, up to demonstrators for aeronautics, automotive and phones capable to address unresolved 4G+ RF FEM requirements and pave the way to 5G.


The RESIST project targets reliability aware design methods and run-time adaptive approaches for next-generation resilient integrated electronic systems in Automotive and Avionics. The focus is on reliability, cost-effectiveness and quality of semiconductor devices. Expected benefits are >2x more cost-effective resilience solutions, >25years lifetime of embedded devices, >20% higher component/integration density at the same level of reliability and up to 30% reduced reliability testing costs.


More-than-Moore (MtM), System-in-Package (SiP), as well as 3D integration technologies are a prerequisite for enabling the design of compact microelectronic devices. In this project new diagnostic tools and advanced methods for material characterization, defect localization, efficient sample preparation, physical failure analysis techniques and workflows are investigated to enable reliable advanced micro-systems based on MtM, SiP, and 3D technologies for European core applications.


SCOTT - Secure Connected Trustable Things will provide comprehensive cost-efficient solutions of wireless, end-to-end secure, trustworthy connectivity and interoperability for various application domains to bridge the last mile to market implementation.

SEMI Europe

SEMI® connects more than 2,000 member companies and more than a quarter-million professionals worldwide to advance the science and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped its members grow, create new markets, and address common industry challenges together. More info: www.semi.org, and follow SEMI on LinkedIn and Twitter.


Competitive production in Europa will be leveraged by a well-focused approach of automation and smart production system integration in the domains of technologies, tools and methodologies which are complemented by innovations in the area of secure communication, knowledge management, automated decision-making, and smart (agile) production execution.


The project is the next in a chain of thematically connected pilot line projects which are associated with the development for the 12 and 10nm technology node. The objective is demonstration of 7nm IC technology integration in line with the industry needs on real devices at imec using innovative device architecture and comprising demonstration of a lithographic platform for EUV and immersion technology, advanced process and holistic metrology platforms, new materials and mask infrastructure.


SERENE-IoT project aims at contributing to develop high quality connected care services and diagnosis tools based on Advanced Smart Health-Care IoT devices, fully manufactured in Europe, enabling a good level of healthcare quality of service for patients remotely followed by professional caregivers, all at much lower cost than the traditional care provided today.

Silicon Europe

Silicon Europe is the European cluster alliance for innovative electronics & software technologies. It unites the strongest European clusters with access to the most advanced technologies and expertise in all fields of the electronics value chain. The "umbrella network" stands for a new, industry-led level of transnational collaboration. It transfers the national cluster concept of strong cooperation across organizational and institutional borders onto a European level. Together the cluster's ecosystem and their 2500 members working on science and industry represent more than 400,000 jobs.


The SilverStream project is developed to address the challenges associated with new technologies for future urban mobility. In particular, SilverStream will develop and demonstrate a radically new light and affordable vehicle concept (L-category) for the ageing population in congested European cities with scarce parking space. The SilverStream project combines both ergonomic concepts conceived for elderly people and advanced automotive technologies for better driveability and energy efficiency.


The SiNANO Institute is a non profit Association founding in 2008 aiming at establishing a durable EU Network of researchers in order to form a distributed Centre of Excellence in the nanoelectronic field. More than 1 200 scientific and technical staffs are working together in this field in the SINANO Institute. The 23 SINANO Institute members are renowned European research organisations and universities, from 12 european countries, in the field of nanoelectronics.


More than Moore, 3D high density, and System-in-Package technologies are prerequisites for compact system integration. SiPoB-3D aims at building up a design methodology for 3D integrated systems, which includes chip, package, and board domain. Both the design of a compact system and the understanding of the physics of the applied technologies and materials are focus. Data transfer between the three different domains is investigated. Target is a global optimum on chip, package and board level.


Smart 4 Europe supports the Smart Anything Everywhere initiative: expand the existing website to an innovation portal as central contact point, share best practice and experience, facilitate brokerage, coordinate communication, dissemination and exploitation activities as well as identify new technologies.


Smarter-SI provides access to small lot fabrication of Smart Systems: small volume - high value. The cooperative foundry is formed by RTOs, taking advantage of existing building blocks.


The oceans host substantial vital resources, namely oil and gas, whose industry will move to ever deeper waters, and where valuable renewable energy continues to be harvested. SWARMs will expand the use of robotic sea vehicles and facilitate the creation, planning and execution of maritime and offshore operations. This will make autonomous operations a viable option for new and existing industries, reducing operational costs, increasing the safety of tasks and help to expand the offshore sector.


The project is the next in a chain of thematically connected pilot line projects which are associated with the development for the 10 and 7nm technology node. The objective of the project is demonstration of 5nm patterning in line with the industry needs using innovative design and technology co-optimization, layout and device architecture exploration, and comprising demonstration of a lithographic platform for EUV technology, advanced process and holistic metrology platforms and new materials.


The objective is to develop and demonstrate lithographic, metrology, process and integration technologies enabling module integration for the 5nm node in the imec pilot line. This is planned with available EUV scanners optimized for mix and match with existing DUV scanners, and with system design and development of a new hyper NA EUV scanner to enable more single exposure patterning at 5nm. Module process steps are developed and evaluated morphologically and electrically using a test vehicle.


Today, the trend goes towards open CPS devices and we see a strong request for open platforms, which act as computational basis that can be extended during operation. The main goal of TAPPS is to extend and customize CPS devices with new 3rd party services and features in an Apps platform in an efficient, secure and trusted way. TAPPS goes beyond traditional solutions for safety, security and reliability in the CPS domain and offers a new approach towards extensibility of CPS platforms.


The TARANTO project targets to break the technological barriers to the development of the next BiCMOS technology platforms, allowing the improvement of the performance of the HBT (Heterojunction Bipolar Transistors) with a much higher level of integration. This new generation of transistors HBT will be a key factor to meet the needs of highspeed communications systems and high data rate required for the integration of heterogeneous intelligent systems as well as for intelligent mobility systems


The program THINGS2DO is focused on building the European Design & Development Ecosystem for FD-SOI-technology. This technology is uniquely positioned to take advantage of some very distinct strengths of the European Semiconductor Industry. This project will also demonstrate the benefir of FDSOI technology in application diomains such as Automotive, Aeronautic and IoT.


The objective is to develop and demonstrate a scalable, thermally-enabled 3D integrated optoelectronic platform that can meet the explosion in data traffic growth within ICT. The Thermally Integrated Smart Photonics Systems (TIPS) program will heterogeneously integrate micro-thermoelectric coolers (µTEC) and micro-fluidics (µFluidics) with optoelectronic devices in order to precisely control device temperature and thus device wavelength compared to commercially available discrete technology.


Innovative automotive systems require complex semiconductor devices currently only available in consumer grade quality. TRACE will develop and demonstrate methods, processes, tools to facilitate usage of CE components to be deployable more rapidly in the life-critical automotive domain.


The project acronyme stands for "TSV Hvm AND Yield optimization" TSV (Through Silicon Via) enables new chip architectures. Some challenges reside along the several steps of process to make TSV products cost efficient. The project aims at supporting the HVM ramp-up and improving the yield for manufacturing TSV products, at certain steps involving material handling, substrates logistics and temporary bonding.


Watify is a project funded by DG GROW which aims at raising the awareness among traditional smes of the importance and benefits of digitization and technological transformation around Europe. It specifically targets SMEs, notably in manufacturing, healthcare, finance and creative industries as well as mechanical engineering, construction, tourism, retail and agro-food, that can drive economic and/or social value by creating and using novel digital and advanced technologies.


The main objective is to establish a Pilot Line in STMicroelectronics Crolles and SOITEC Bernin to promote and sustain the FD-SOI technologies in Europe for the next years. This pilot line will offer an optimized Power-Performance-Area-Cost (PPAC) trade-off for FD-SOI technology platform based on Fully Depleted (FD) devices built on advanced Silicon On Insulator (SOI) substrate.


Technology scaling has enabled RF-CMOS circuits to operate in the mm-wave frequency range (30 to 300GHz) where large bandwidths are available. These bandwidths are exploited in radar applications (automotive at 77GHz) and in high data rate wireless communications (point-2-point link, new 5G radio interface). It also enables a new kind of wireline communication for short to medium distances: at mm-Wave frequencies, the “wire” can be a low-cost and low-weight plastic fiber or hollow tube


The aim is to develop reliable technology bricks for efficient and cost-effective applications addressing market segments where Europe is a recognized global leader as well as automotive, avionics, and railway, doing it by designing and prototyping on SiC based highly integrated power converters, bringing together the vertical value chain (e.g. packaging producers, passive component producers and the power converter producers), the final users and the academic entities .


WssTP is the recognized voice and promotor of water-related RTD and innovation in Europe. It is recognized by the EC as industry-led European Technology Platform for the Water The mission of WssTP is to: Improve coordination and collaboration in the water sector and water using sectors; Enhance performance of the European water sector and water using sectors; Contribute to solving societal challenges through RTD&I. WsstP membership covers the full value chain of the water sector.