Exhibition

Projects results and project proposals

EFECS2017-exhibition


EFECS will feature an exhibition that includes:

  • running R&D&I projects
    Dissemination of the project's innovation and progress
  • new project ideas
    Showing the technological challenges that are still to be faced, and networking with potential consortium partners
  • affiliated organisations
    Associations, alliances, ETPs and similar groupings that represent companies/institutes/universities with ECS R&D&I activities in Europe
  • the organisers of the event
    Showing their activities in the area of Embedded Components and Systems
  • speakers corner
    Giving opportunities for selected organisations in the field to report on their activities

Speakers corner

Presentation sessions at the EFECS exhibition

WhenTitleSpeakerSubject
20 Nov @ 12:20-12:40Eco-System electronicsEco-System electronicsInformation will follow
20 Nov @ 12:40-13:00How the CSA Industry 4.E help Industry4.E related projects and programmes achieve their full synergistic potentialCSA Industry4.E consortiumOutlining how the Coordination Support Action (CSA) will support and facilitate the goals of the Industry4.E Lighthouse Initiative through proactive actions designed to promote an environment in which projects and stakeholders can more readily network, interact and cooperate. By identifying and capitalising on complementary opportunities in strategic planning, networking and coordination between initiatives across Europe, this CSA will help Industry4.E related projects and programmes achieve their full synergistic potential. Additionally, by improving standardisation, dissemination, public awareness and communications, the CSA will help raise the profile of Industry4.E issues and so create a culture in which the 4th Industrial Revolution may thrive.
20 Nov @ 15:10-15:30Interoperability Coordination Forum (ICF)ICFThe increasing connectivity and integration further drives the importance of interoperability, for development environments and operational phases; many projects and efforts will need interoperability in one way and or another. In order to avoid recreating the wheel too often, it becomes essential to disseminate what has been achieved so far and stimulate critical mass efforts that build upon and leverage useful existing results and standards.
21 Nov @ 10:30-10:50Democratizing robotics integrationSAPThere is a new generation of robots, so-called service robots or “cobots”. They are human safe and intelligent, they can work side-by-side with humans and they cost about a quarter of what traditional robots cost. This makes them interesting to SMEs and to environment with one-off tasks. Yet, programming and integrating them remains expensive. This is the problem Google addresses jointly with SAP. Through its new Robotics cloud platform, Google makes these robots smart, providing cartography and artificial intelligence, effectively providing spatial intelligence, recognition of 4D workspaces and objects. The joint effort provides plug-and-play with SAP applications. Independent from a given robot manufacturer, 3rd party developers can deploy the very same software container to any robot (E.g., for route optimization). This makes robot deployment and access to machine learning, cartography, and many other services incredibly inexpensive and easy for users in industry and research.
21 Nov @ 10:50-11:10European Network on High Performance and Embedded Architecture and CompilationHiPEACHiPEAC was created in 2004, and has since then supported the European Computing Community with training, talent search, roadmapping, networking. HiPEAC currently prepares the European Computing Community for the transition to Horizon Europe with its focus on innovation and on sustainability. The session will present HiPEAC, and the benefits it offers for the ECSEL community.
21 Nov @ 13:05-13:25Silicon Europe - your gateway to innovative SMEsSilicon EuropeSilicon Europe unites the strongest European clusters in an alliance with access to the most advanced technologies and expertise in all fields of the electronics and software value chain. Silicon Europe is the brand under which the leading European electronics and digitization clusters collaborate to represent, support and promote the companies and organizations of their regional business networks at European and global levels. Silicon Europe acts as an intermediary between all the relevant partners from research and academia, public authorities and industry. Twelve renowned European clusters have joined forces to support Europe’s goal to be the world’s leading center for innovative electronics & software technologies.
22 Nov @ 10:30-10:50System Design and Heterogeneous IntegrationPolitecnico di TorinoPresentation of NEREID Roadmap on System Design and Heterogeneous Integration. Description of the new application-driven approach used for mapping system level requests and future needs for the design and implemenation of Electronic Systems and Applications./td>
22 Nov @ 13:00-13:20Smart Energy for power applications and autonomous IoT systemsCEAPresentation of the NEREID Roadmap for Energy related components and systems, from power electronics to autonomous sensing and energy harvesting. The technology forecast generated by a panel of experts presents the evolution of components, compares competing technologies and makes predictions for the coming years. A brief comparison of other roadmaps as well as an overview of the driving factors for implementation will provide context for discussion.
22 Nov @ 13:20-13:40New Paradigms and Technologies for edge computing in future AI applicationsGrenoble INP - CNRSPresentation of NEREID Roadmap for edge computing including: i) Low power/high performance Nanoscale FET, using ULP design, Nanowire, Ultimate FET architecture, ii) Emerging devices and alternative information processing paradigms,like Small Slope Switches for very low power operation, novel computing approaches (as Neuromorphic, Quantum, Bio-Inspired) for big data and/or ultra low power, Spintronics in interconnects and signal processing to realise ultra low power, compact and fast technology.

Exhibitors list

The following organisations and projects will be represented at the EFECS exhibition. Click on a name to read more details.

Organisers:

  • AENEAS
  • ARTEMIS-IA
  • ECSEL-JU
  • EPoSS
  • European Commission
  • EUREKA

Affiliations:

  • AIOTI
  • Digital Sweden
  • ETPIS
  • EUREKA ICT Clusters
  • HiPEAC
  • SAP SE
  • SEMI Europe
  • Silicon Europe
  • SiNANO Institute - NEREID
  • Textile-ETP - CeNTI

SMEs:

  • AlphaSIP
  • IMA

Projects:

  • 3Ccar
  • 5G_GaN2
  • AMASS
  • Anti-SUPERBugs
  • ASCENT
  • ASTONISH
  • AutoDrive
  • Bonseyes
  • CAPID
  • CISTERN
  • CITCOM
  • CogniWin
  • COMPOSITION
  • CONNECT
  • CosmoDU
  • COSMOS
  • CSA Industry4.E
  • DEIS
  • DIATOMIC
  • DISPERSE
  • dReDBox
  • E450LMDAP
  • EAST
  • ENABLE-S3
  • EnABLES
  • ENSO
  • EPI
  • ESAIRQ
  • EuroPAT-MASIP
  • EUROPRACTICE
  • FITOPTIVIS
  • H2O
  • HADES
  • HiPERFORM
  • Ideal-ist
  • iDev40
  • InovWine
  • InSCOPE
  • inSSight
  • IoSense
  • Lighthouse Industry4.E
  • Lighthouse Mobility.E
  • Megam@rt2
  • MICROPRINCE
  • More Moore
  • MUSIC
  • Nanonets2Sense
  • NeuRAM3
  • NexGen
  • NOBEL
  • OCEAN12
  • PRIME
  • PRYSTINE
  • R2power300
  • R3-PowerUP
  • SafeCOP
  • SAFEPOWER
  • SAM3
  • SCOTT
  • SDK4ED
  • SECREDAS
  • SeNaTe
  • SENSATION
  • SERENE-IoT
  • SILENSE
  • SiPoB-3D
  • Smart Anything Everywhere
  • SSI Trademark
  • SUPERAID7
  • TagItSmart
  • TAKE5
  • TAKEMI5
  • TRACE
  • TSV-Handy
  • ULIMPIA
  • WAKeMeUP

Floorplan

EFECS 2018 Exhibition floorplan

The floorplan of the EFECS 2018 exhibition will be published here soon after the Booth application deadline has passed.