AENEAS is an Association, established in 2006, providing unparalleled networking opportunities, policy influence & supported access to funding to all types R&D&I participants in the field of micro and nanoelectronics enabled components and systems. In 2008, AENEAS is named as private member of the ENIAC-JU Governing Board and is thus the official voice of micro- and nanoelectronics organisations in the programme. In 2014, with the successful completion of the ENIAC-JU, the ECSEL-JU is set up to adress the entire ECS value chain. Three private members of the ECSEL-JU Governing Board are identified: AENEAS, ARTEMIS Industry Association and EPoSS. In 2015, the Association's scope is expanded to cover the whole ECS Value Chain. The remaining office tasks of the EUREKA Cluster CATRENE are entrusted to AENEAS. The management of PENTA, a new EUREKA Cluster on micro- and nanoelectronics enabled systems and applications, is delegated to AENEAS.

The object of the Association is to promote research, development and innovation in order to strengthen the competitiveness of European industry across the electronics components and systems (ECS) value chain.

AENEAS is open to all European key players in the value chain, such as large industry, Small and Medium Enterprises, research institutes, academia, and associations. Currently nearly 220 organisations are registered as members of the Association.

More information about AENEAS: https://aeneas-office.org

ARTEMIS Industry Association strives for a leading position of Europe in Embedded Intelligence. The Association is a membership organization for the European R&I actors with more than 180 members and associates from all over Europe. The multidisciplinary nature of the membership provides an excellent network for the exchange of technology ideas, cross-domain fertilisation, as well as for large innovation initiatives.

ARTEMIS Industry Association believes that there are no sharp delineations between technologies, and that such technologies should not be considered in splendid isolation. These areas together will allow the rise of new innovative businesses that support the opportunities for value creation in several sectors that Embedded Intelligence creates. In an industrial context Cyber-Physical Systems encompasses a wider class of systems than Embedded Systems in their most narrow definition. Therefore, ARTEMIS-IA distinguishes three focus areas that together create this wider industrial context of Embedded Intelligence:

• Embedded and Cyber-Physical Systems
• Internet of Things
• Digital Platforms

As private partner in ECSEL Joint Undertaking, ARTEMIS-IA supports formation of consortia and initiation of project proposals for joint collaboration and creates the meeting place where key industry players and other R&D&I actors identify strategic high priority topics for collaborative R&I projects.

More information about ARTEMIS: https://artemis-ia.eu

ECSEL Joint Undertaking: the Public-Private Partnership keeping Europe at the forefront of technology development.

Electronic components and systems (ECS) are a pervasive Key Enabling Technology, impacting all industrial branches and almost all aspects of life. A smartphone, a smart card, a smart energy grid, a smart city, even smart governance; everything “smart” is based on integrating semiconductor chips running embedded software. They provide the fabric on which the internet runs; they give life to portable phones and tablets; they drive driverless cars and trains, fly airliners, drones and satellites. In modern times, no national economy can win in the global competition without mastering this technology, with unparalleled systemic and strategic impact.

The ECSEL JU objectives:

• Contribute to the development of a strong and globally competitive electronics components and systems industry in the European Union;
• Ensure the availability of electronic components and systems for key markets and for addressing societal challenges, keeping Europe at the forefront of technology development, bridging the gap between research and exploitation, strengthening innovation capabilities and creating economic and employment growth in the Union;
• Align strategies with Member States to attract private investment;
• Maintain and grow semiconductor and smart system manufacturing capability in Europe;
• Secure and strengthen a commanding position in design and systems engineering;
• Provide access for all stakeholders to a world-class infrastructure for design and manufacturing;
• Build a dynamic ecosystem involving Small and Medium-Sized Enterprises (SMEs), strengthening existing clusters and creating new clusters.

Members of ECSEL JU:

• the European Union (through the Commission);
• Member States and Associated Countries to the Framework Programme Horizon 2020 on a voluntary basis;
• Three associations (EPoSS, AENEAS and ARTEMIS Industry Association) representing the actors from the areas of micro- and nano-electronics, smart integrated systems and embedded/cyber-physical systems.

More information about ECSEL JU: http://ecsel.eu

EPoSS, the European Technology Platform on Smart Systems Integration, is an industry-driven policy initiative, defining R&D and innovation needs as well as policy requirements related to Smart Systems Integration and integrated Micro- and Nanosystems. EPoSS is contributing to EUROPE 2020, the EU's growth strategy for the coming decade, to become a smart, sustainable and inclusive economy.

EPoSS brings together European private and public stakeholders in order to create an enduring basis for structuring initiatives, for co-ordinating and bundling efforts, for setting-up sustainable structures of a European Research Area on Smart Systems Integration. EPoSS embraces all key players, public and private, in the value chain so as to:

• provide a common European approach on Innovative Smart Systems Integration from research to production outlining the key issues for a strategic European innovation process,
• define priorities for common research and innovation in the future,
• formulate commonly agreed road maps for action (updating, assembling and completing existing material and approaches) and provide a strategic R&D agenda, and
• mobilise public and private human, infrastructural and financial resources.

The initiative is of immediate importance in view of defining research and technology priorities for the "Horizon 2020" programme - the EU Framework Programme for Research and Innovation, for raising more critical mass and resources and for coordinating between different initiatives (national, regional, EUREKA, European public funding, and industry).

More information about EPoSS: www.smart-systems-integration.org

The European Commission is the executive division of the European Union, which takes decisions on the Union's political and strategic direction, while promoting its general interest. The European Commission is structured into Directorates-General (DGs) which are responsible for developing policies for specific areas. DGs develop, implement and manage EU policy, law, and funding programmes, in addition to dealing with particular administrative issues.

One of the main pillars of the European Commission is the Directorate‑General for Communications Networks, Content and Technology (DG CONNECT). It is the division responsible for conceiving and implementing the policies required to create a Digital Single Market in Europe, for more growth and jobs, where citizens, businesses, and public administrations can seamlessly and fairly access and provide digital goods, content and services. The Digital Single Market strategy, identified as one of the Commissions 10 political priorities, aims to open up digital opportunities for people and business and enhance Europe's position as a world leader in the digital economy.

DG CONNECT is responsible for implementing the EU Horizon2020 Research and Innovation Programme in the field of ICT. Amongst the policies developed and actions taken are the current measures to Digitise European Industry, which will help companies' large and small, researchers and public authorities to make the most of digital technologies, such as micro/nano electronics and integrated microsystems, to name a few.

More information about the European Commission: https://ec.europa.eu

EUREKA is a publicly-funded, intergovernmental network, involving over 40 countries. EUREKA’s aim is to enhance European competitiveness by fostering innovation-driven entrepreneurship in Europe, between small and large industry, research institutes and universities. By doing this, EUREKA concentrates the existing potential of experts, of knowledge, research facilities and financial resources in a more efficient way. EUREKA is constantly proving its value through a wealth of success stories – innovative products, processes and services that have been launched onto the market over the last 30 years, creating additional turnover and jobs for European companies, small and large – and by supporting the internationalization of businesses with innovative ideas.

EUREKA is a leading open platform for international cooperation in innovation. It is present in over 40 countries and remains to this day the only initiative of its kind committed to the ‘bottom-up’principle - ensuring that any R&D project with a good business plan receives the support it deserves, independent of its technological nature, or the type of organisations involved.

More information about EUREKA: www.eurekanetwork.org

The Alliance for Internet of Things Innovation (AIOTI) was initiated by the European Commission in 2015, with the aim to strengthen the dialogue and interaction among Internet of Things (IoT) players in Europe, and to contribute to the creation of a dynamic European IoT ecosystem to speed up the take up of IoT.

Digital Sweden is a gathering of Swedish actors in electronics, ICT and automation for a more efficient presence and influence in Brussels and an increased cooperation in Sweden. Digital Sweden is the Swedish ECSEL Mirror group supporting organisations for the ECSEL programme.

ETPIS is a European Platform, approved by the European Commission. PESI (Spanish Technology Platform on Industrial Safety) is a non-profit association, formed by around 300 agents and fully led by Spanish Industry. We support our members (Corps & SME, industry associations, research centers and universities) in taking part in any call related to FP7, H2020 or other programmes. PESI is a long-standing member of ETPIS.

EUREKA ICT Clusters: EURIPIDES, CELTIC, PENTA, ITEA.

European Network on High Performance and Embedded Architecture and Compilation.

Software Company

SEMI connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together.

Silicon Europe unites the strongest European clusters in an alliance with access to the most advanced technologies and expertise in all fields of the electronics and software value chain.

Silicon Europe is the brand under which the leading European electronics and digitization clusters collaborate to represent, support and promote the companies and organizations of their regional business networks at European and global levels. Silicon Europe acts as an intermediary between all the relevant partners from research and academia, public authorities and industry.

The SiNANO Institute, European Academic and Scientific Association for Nanoelectronics, provides a large expertise in the field of Micro and Nanoelectronics with 23 renowned European research Organisations and Universities, and is the European representative for IRDS “International Roadmap for Devices and Systems”.

NEREID has developed a roadmap for the European nanoelecronics industry, starting from the needs of applications and leveraging the strengths of the European eco-system. It has lead to an early benchmark/identification of promising novel nanoelectronic technologies, and an identification of bottlenecks all along the innovation (value) chain.

CeNTI (Centre of Nanotechnology and Smart Materials) is a private, non-profit research institute, placed in Portugal, equipped with cutting-edge technology and conducting world-class R&D. CeNTI provides, in a business to business approach, applied R&D, engineering and scaling-up production of innovative functional & smart materials and devices. CeNTI is currently collaborating with the Textile-ETP on an expert group on Smart Textiles (Textile Flagship 5).

Established in 2008, AlphaSIP is a Spanish bio-nanotech company focused on the design, development, production and sales of medical diagnostic devices. Our products allow immediate and effective disease and substance detection, promote better health care services for patients and assist roadside security. AlphaSIP closely cooperates with the main companies in the top mobile app developers semiconductor industry as well as benchmark research groups in the area of nanotechnology. Alpha Szenszor Inc., the Complutense University of Madrid, the Nanoscience Institute of Aragon, the Life Science Institute of Aragon, the University of Zaragoza, the National Microelectronic Center of CSIC and the CEEI Aragon are some examples of the outstanding partners we count with.

Institute of Microelectronic Applications (IMA) s.r.o. is a leading Czech manufacturer and supplier of innovative identification solutions for both public and private sector. We open tens of thousands of doors every day for our clients like Czech National Electricity Company, Skoda Auto, Czech Technical University in Prague, mBank Poland or new residential districts in Stockholm.

3Ccar addresses the ever growing complexity in mobility systems, especially in Electrified Vehicles (EV). Complexity control and reduction, translated into highly innovative semiconductors, enable improved energy efficiency, while enhanced systems integration leads to significant cost reduction, all enabling widespread EV deployment. Highly reliable electronic active safety systems contribute to Safety in Traffic ("Zero Accident Driving"), while cooperative traffic management systems will contribute towards congestion-free traffic.

The fifth generation (5G) communications technologies will provide internet access to a wide range of applications: from billions of low data rate sensors to high resolution video streaming. The 5G network is designed to scale across these different use cases and will use different radio access technologies for each use case.

To support very high data rates 5G will use wide bandwidth spectrum allocation at mm-wave frequencies. The offered bandwidth at the mm-wave frequencies (above 24 GHz) is more than 10 times as large as that in the lower bands (sub 6 GHz). However, the move to mm-waves comes at a cost – increased path loss. This makes it extremely challenging to provide coverage at mm-wave frequencies.

A partial remedy is to use beamforming to direct the radio energy to a specific user. For some deployment scenarios beamforming is not enough and the output power must also be increased. A major challenge is to bring affordable, high-performance mm-wave active antenna arrays into production. There is currently a market pull for this systems but there exists a capability gap.

5G_GaN2 project will substantially lower the cost and power consumption, and increase the output power of mm-wave active antenna systems. The maximum output power and energy efficiency results will be possible thanks to the use of advanced Gallium Nitride (GaN) technology. In addition, low-cost packaging techniques for digital applications will be further developed to reach the cost and integration targets.

The capabilities of the developed technology will be shown in a set of demonstrators. The application driven demonstrators will be used to guide the technology development towards maximum impact and exploitation in the post project phase. The consortium spans the complete value chain: from wafer suppliers, semiconductor fabrication and system integrators. In addition, key universities and research institutes guarantees academic excellence throughout the project.

AMASS (Architecture-driven, Multi-concern and Seamless Assurance and Certification of Cyber-Physical Systems) is an ECSEL project that is creating and consolidating the de-facto European-wide open tool platform, ecosystem, and self-sustainable community for assurance and certification of Cyber-Physical Systems in the largest industrial vertical markets including automotive, railway, aerospace, space, and energy.

Anti-SUPERBugs PCP project wants to mobilize public and private purchasers and networks of users in the field of health-care associated infections to put the joint & direct procurement process in action, having participating understood the innovation gap to be addressed by significant R&D, extending and leveraging the complementarities of the consortium partners to bring together the demand in order to create a critical mass to acquire cost-effective and fit-to-purpose solutions, whilst creating new jobs and opportunities for business growth in Europe, with particular reference to SMEs.

Read more: http://antisuperbugs.eu

ASCENT (Access to European Nanoelectronics) provides fast, easy and free-of-charge access to the world’s most advanced CMOS technologies and infrastructure.

This includes:

• Access to 14nm CMOS device data, test chips and characterisation facilities in Tyndall National Institute (Ireland), CEA-Leti (France) and imec (Belgium).
• An opportunity to share best scientific and technological practices, form a knowledge–innovation hub, train new researchers and establish a nanoelectronics research network.
• Interface to global industrial leaders in nanoelectronics

Advancing Smart Optical Imaging and Sensing for Health.

AutoDrive project advances fail-aware, fail-safe, and fail-operational electronic components, systems, and architectures for highly and fully automated driving to make future mobility safer, affordable, and end-user acceptable.

Artificial Intelligence is projected to add over €13 trillion to the global economy by 2030 but companies outside of the US and China risk being shut out by the ‘data wall’ dominated by internet giants. The Horizon 2020 project “Bonseyes” is an industry driven collaborative R&D project of 14 partners bringing together leading European research institutes as well as industry leaders in embedded systems. It aims to get companies over the wall using the new power of edge computing and by leveraging Europe’s leadership in embedded systems. Bonseyes will enable a platform for open development of AI systems which are emerging as a key growth driver in Smart CPS systems in the next decade. Opposed to monolithic system design methodologies currently used in closed end­-to-­end solutions, Bonseyes will focus on an open architecture to enable an eco-system of companies to collaborate in building complex distributed “intelligent” systems

The CAPID project develops a new wireless tag technology for item level identification. The technology is different from RFID and NFC tags. It is based on a different communication principle - capacitive energy and data transfer. Small capacitive antennas are manufactured directly on chip, as part of the semiconductor process. A simple and very low cost tags - no external antenna coil or assembly process is required.

This project researched technologies for CMOS image sensors that are needed in the next generation of several application domains.
The image sensor research focused on:

• Better pixels (lower noise, higher dynamic range, new functionality within the pixel);
• More pixels (higher spatial and temporal resolutions); and
• Sensor related processing.

Application domains that were covered are:

• Digital Lifestyle: broadcast & entertainment (Grass Valley, Delft University of Technology, SoftKinetic);
• High-end Security (Adimec, Le2i); and
• Multi-spectral imaging for specific applications e.g. food sorting (Le2i).

The prototype CMOS sensors for each application domain have been demonstrated together with the sensor related processing.

CITCOM aims to develop an in-line inspection, measurement and control system for high reliability and detailed monitoring and inspection of MEMS, micro-components and micro-devices based on a 3D optical quality inspection system, robotic manipulation for sorting and nano-focused 2D X-ray system.

CogniWin project aimed to provide an answer to the challenges faced by older adults in the workplace by providing an innovative personalised system that motivates them to stay active and productive for longer in computerised working environments. SensIn was developed under the CogniWin project and supports people working in computerized environments during their professional activities, namely elderly in office and productivity working settings, or people in stressfull jobs. To achieve this vision, we collect local data generated during interaction of user with computer using a mouse with biometric sensors (heart rate, galvanic skin response, grip force, temperature and motion information) and based on these data, it derives wellbeing status from objective assessments.

The COMPOSITION project aims to develop an integrated information management system (IIMS) for the manufacturing industry which optimises the internal production processes by exploiting existing data, knowledge and tools to increase productivity and dynamically adapt to changing market requirements.

Innovative smart components, modules and appliances for a truly connected, efficient and secure smart grid.

Compact, highly smart, modular drive control unit directly integrated in the electrical motors.

CSA for Lighthouse Initiative Mobility.E. COSMOS: COherent Support for MObility.E Strategy.

CSA for Lighthouse Initiative Industry4.E

DEIS: Dependability Engineering Innovation for CPS. The open and cooperative nature of CPS poses a significant new challenge in assuring dependability. The DEIS project addresses this important and unsolved challenges by developing technologies that form a science of dependable system integration. In the core of these technologies lies the concept of a Digital Dependability Identity (DDI) of a component or system. DDIs are composable and executable in the field facilitating (a) efficient synthesis of component and system dependability information over the supply chain and (b) effective evaluation of this information in-the-field for safe and secure composition of highly distributed and autonomous CPS. This concept shall be deployed and evaluated in four use cases.

DIATOMIC is a network of three Digital Innovation Hubs, funded under the European Smart Anything Everywhere (SAE) initiative (ICT-04-2017). Designed as a one-stop shop, DIATOMIC aims to accelerate product and service innovation through electronic components, sensors, smart objects and integrated systems in health, agrifood and manufacturing sectors. Two open calls for consortium Application Experiments will be launched.

DISPERSE will optimize the workflow for MRI scanning of patients with multiple implants by developing electronics for spatially distributed sensor and transducer arrays. The innovation efforts exploit synergies between the health, space and smart city domains.

The dReDBox project (Disaggregated Recursive Datacenter-in-a-box) – funded under agreement No. 687632 by the EC H2020 programme aspires to innovate the way we build datacentres today, shifting to employing pooled, disaggregated – instead of monolithic, tightly integrated components. By doing so, the dReDBox proposition has the ambition to lead to significantly improved levels of utilization, scalability, and power efficiency, both in conventional cloud and edge datacentres.

Enable of CMOS Semiconductor technology to migrate to the next generation (Moore's Law).

EAST (smart Everything everywhere Access to content through Small cells Technologies) will develop enablers and facilitators for 5G Small cells mobile networks up to 6 GHz. Key targets in comparison to existing 3/4G solutions are: enhanced data rates (video bandwidths > 100MHz), higher integration (10x to 100x size reduction), higher functionality (MIMO), dramatic costs reduction (10x to 100x), higher overall system efficiency (>60%), and re-configurability (multiple-transmit bands). To achieve these ambitious goals, major steps have to be taken at the system/design level (novel transmitter architectures), at the technology level (new silicon processes and packaging solutions), as well as in the development of characterization and modelling tools.

V&V for automated systems.

European Infrastructure Powering the Internet of Things.

EnSO “Energy for Smart Objects” project is focusing on an essential generic need within IoT, providing Autonomous Micro Energy Sources (AMES). Main EnSO’s objectives are:

• Demonstrate the competiveness and manufacturing readiness of EnSO energy solutions (AMES) in Europe.
• Develop and demonstrate high capacity (> 20mA.h) and high density (> 300Wh/l), low profile, shapeable, long time, rechargeable micro battery product family supported by efficient and reliable energy harvesters as well as easy charging
• Disseminate and standardize EnSO energy solutions with easy to use demonstration kits for a large number of use cases

The European Processor Initiative (EPI) gets together 23 partners from 10 European countries, with the aim to bring to the market a low power microprocessor.

It gathers experts from the High Performance Computing (HPC) research community, the major supercomputing centres, and the computing and silicon industry as well as the potential scientific and industrial users. Through a co-design approach, it will design and develop the first European HPC Systems on Chip and accelerators. Both elements will be implemented and validated in a prototype system that will become the basis for a full Exascale machine based on European technology.

Triggering the demand for sensors to measure environmental air quality by improving technological capabilities. Further developing essential technologies for gas sensing.

The EuroPAT-MASIP project will reinforce the European semiconductor manufacturing position through focusing in the semiconductor and MEMS packaging ecosystem. Semiconductor packaging, assembly and test involve most of the semiconductor value chain, ranging from material suppliers to software design and packaging foundries to test houses. EuroPAT-MASIP will consolidate and extend the leadership in semiconductor processing know-how, by developing and fostering packaging related technological and manufacturing building blocks, serving different (emerging) industrial sectors.

More information: http://europat-masip.eu

The EUROPRACTICE service has enabled more than 600 European universities and research institutes easy and affordable access to advanced microelectronics-based design tools, prototyping and dedicated training for over 25 years. This service has been used by virtually all universities in Europe and many SMEs engaged in microelectronics. It is the objective to extend this platform with additional services, such that academia and industry can develop smart integrated systems, from advanced prototype design to volume production. The latter will be achieved by providing easy and affordable access to a wide range of fabrication technologies and tools complemented with training and support to the customer in all critical steps which are needed.

FITOPTIVIS aims to develop a cross-domain approach for smart integration of image- and video-processing pipelines for CPS covering a reference architecture, supported by low-power, high-performance, smart devices, and by methods and tools for combined design-time and run-time multi-objective optimisation within system and environment constraints.

H2O (Human 2 Object), a follow-up project to eGo, takes 'wearable computing' to the next level. It does so by stimulating and promoting human-computer interaction and smart wearable-devices through developing and testing key elements needed to drive and support the resulting emerging businesses based on Internet of Things and e-Mobility, e-Health and e-Commerce applications.

The HADES project aims at providing a hierarchy-aware smart and secure embedded test infrastructure for dependability and performance enhancement of integrated systems.

The project focus is on the investigation of industrial applicability of high-performance semiconductors with wide-band gap materials in the field of Smart Mobility. For this purpose, a holistic approach is selected including the entire supply chain - from the manufacturer of semiconductors as well as power modules through suppliers of development methods and tools to the system and ultimately the vehicle manufacturers. The integration of academic partners with a high level of competence in these domains completes this approach. On the other hand, specific requirements for power electronics are addressed in specific application areas, which include both power inverters in the vehicle, electrical charging modules inside and outside the vehicle, as well as the associated test systems.

The Ideal-ist project is funded by the European Commission, and acts as National Contact Point (NCP) network, supporting research and innovation activities for the EU Framework Programmes.

iDev40 offers solutions to societal challenges addressing European policies for 2020 and beyond:

• Digitalization in integrated product development & production, along value chains for the entire product lifecycle (digital twin):
• linking digital and real world with new Industry 4.0 technologies (AI & ML)
• smarter, more flexible development and production processes speeding up time to market
• real time communication via the IoT between value chain partners
• creating skilled jobs for virtualizing specific areas of logistics, products and processes.
• Increasing European competitiveness and Strengthen the collaboration of key European ECS actors in terms of digitalization.

The project InovWine aims to increase the overall competitiveness of the wine sector through the development of new products and services to the row of the wine and vineyard.It is intended specifically to develop a system for genotyping, selection and certification based on molecular methods; implement a control system and remote monitoring of biotic and abiotic factors associated with the vine which will feed a system of risk detection, warning and prevention of plant diseases; create a collection of wine yeast adapted to regional conditions and market requirements and develop a device for monitoring their dynamics during fermentation.

International Smart Collaborative Open-access hybrid Printed Electronics pilot line (InSCOPE) providing a comprehensive complementary toolbox for Hybrid Printed Electronics manufacturing processes. Set up service infrastructure for hybrid Printed Electronics enable a service of 15 development cases during the project. Demonstrate the commercial viability- present 4 Showcases that will show Hybrid printed electronics capabilities in large volume markets.

inSSIght project, the European Coordination and Support Action which started at the beginning of 2017, has the goal of fostering successful integration of smart systems in a broader spectrum of products and applications.

The major objectives of inSSIght are to secure the position in European policies of SSI as a key enabler for innovation; support the Smart Systems Industry and Community in Europe; as represented by EPoSS (European Technology Platform on Smart Systems Integration); open new market opportunities for SSI by responding to the needs of the demand side.

Furthermore the project will unveil and promote new functions and advantages enabled by the integration of Smart Systems with existing products and processes.

IoSense (Flexible FE/BE Sensor Pilot Line for the Internet of Everything) is to boost the European competitiveness of ECS industries by increasing the production capacity and improving Time-to-Market for innovative microelectronics, accomplished by establishing three fully connected semiconductor pilot lines in Europe: two 200mm frontend (Dresden, Regensburg) and one backend (Regensburg) lines networking with existing highly specialized manufacturing lines. IoSense will provide innovative, competitive, next-generation sensors and sensor systems “Made in Europe” for IoT solutions: LiDAR, sound, pressure, multi-gases, fine dust, 3D time-of-flight, spectrometer, magnetics, temperature.

Industry4.E pulls together the necessary work that is core to the “digitalisation of industry”. To keep production industries competitive, more and more IT- and ECS-driven know-how is needed, based on platforms, standards and appropriate certifications for safety. Present day fragmentation stands in the way of reaping the full benefits offered by digitalisation: Industry4.E will address these issues.

Mobility.E focusses attention on the considerable technological, legislative and infrastructure difficulties facing large-scale deployment of safe, electrically powered, intelligent vehicles: the goal being to deploy a zero-emission / zero-accident mobility system accessible by all.

A scalable model-based framework for continuous development and runtime validation of complex systems

European industry faces stiff competition on the global arena. The electronic systems become more and more complex and call for modern engineering practices to tackle productivity and quality. The model-driven technologies promise significant productivity gains, which have been proven in several studies.

MegaM@Rt proposes an overall model-based approach combining existing techniques to be enhanced when relevant and novel ones to be developed when needed. A fundamental challenge notably resides in providing efficient traceability support between the two levels (i.e. from design models to runtime ones) and also in collecting corresponding feedback in terms of best practices.

The main focus of the MICROPRINCE project is to setup the worldwide first pilot line for micro-transfer printing. Moreover the project aims at showing the pilot line capabilities for five different target applications including Hall Plates and filters for current and optical sensors as well as III/V-based LEDs, modulators and sensors for photonic systems.

More Moore (covers: E450LMDAP, SeNaTe, TAKE5, TAKEMI5). Enable of CMOS Semiconductor technology to migrate to the next generation (Moore's Law).

IoT security.

The Nanonest2Sense project aims at developing a low cost and versatile technology to integrate semiconducting nanowire-based devices above CMOS. Such a technology could provide affordable devices for point-of-care detection of molecules of interest for health monitoring or pre-diagnostics. For demonstration, two types of applications are targeted: the detection of extracted molecules or DNA samples that circulate in body fluids and breath analysis.

Development of novel technology component and new algorithms for neuromorphic circuits applications.

The Project Next Generation of Body Monitoring (NexGen), targets to develop key microelectronic technologies and components for future mobile/wearable health care systems. The feasibility will be demonstrated along 2 interconnected ubiquitous body monitoring systems of high social and economic importance, an implanted glucose monitor and a non-invasive onbody multi-parameter monitor.

The HealthTechTAB (“TAB”) is an instrument sponsored by the EC funded project “NOBEL – Mobilising the European nano-biomedical ecosystem”, which has been designed as the prime initiative to provide free support & guidance to researchers and entrepreneurs in the translation of promising technologies for Healthcare in Europe.

The TAB provides access to industry knowledge through a group of seasoned experts and entrepreneurs with a solid track record of bringing new technologies to the market. For this, the TAB uses an holistic & milestone-driven approach to assess and guide beneficiaries throught the journey to market translation.

The TAB has already been active for the past three years, focusing on nanomedicine as the nanomedTAB, having supported over 100 projects.

OCEAN12, Opportunity to Carry European Autonomous driviNg further with FDSOI technology up to 12nm node.

Low Power Relevance IoT memory design.

PRYSTINE stands for fail-operational sensor-fusion framework on component level, dependable embedded E/E architectures, and safety compliant integration of Artificial Intelligence (AI) approaches for object recognition, scene understanding, and decision making within automotive applications.

Preparing R2 extension to 300mm for BCD Smart Power.

300mm Pilot Line for Smart Power and Power Discretes.

The SafeCOP project that targets the so-called Cooperating Cyber-Physical Systems (CO-CPS), that is systems that rely on wireless communication, have multiple stakeholders, use dynamic system definitions (openness) and operate in unpredictable environments.

The main objective of SAFEPOWER is to enable the development of cross-domain mixed-criticality systems with low power, safety and security requirements.

SAM3: Smart Analysis Methods for 3D Integration. More-than-Moore (MtM), System-in-Package (SiP), as well as 3D integration technologies are a prerequisite for enabling the design of compact microelectronic devices. In this project new diagnostic tools and advanced methods for material characterization, defect localization, efficient sample preparation, physical failure analysis techniques and workflows are investigated to enable reliable advanced micro-systems based on MtM, SiP, and 3D technologies for European core applications.

SCOTT: Secure COnnected Trustable Things. Creating trust in wireless solutions and increasing their social acceptance are major challenges to achieve the full potential of the Internet of Things (IoT). Therefore, SCOTT – Secure COnnected Trustable Things, a pan-European effort with 57 key partners from 12 countries (EU and Brazil), will provide comprehensive cost-efficient solutions of wireless, end-to-end secure, trustworthy connectivity and interoperability (Technology Readiness Level 6-7) to bridge the last mile to market implementation. SCOTT will not just deal with ‚things that are connected‘, but with ‚trustable things that securely communicate‘, i.e. things interconnected by dependable wireless technology and valuing the end-users‘ privacy rules.

The European Commission-funded project SDK4ED – Software Development ToolKit for Energy Optimization and Technical Debt Elimination – will provide a framework to automatically optimize software for certain quality requirements, such as energy efficiency and dependability, while managing technical debt, where choosing an easy solution leads to additional rework along the line. SDK4ED is developing methods and tools to parse software artefacts (source code, design models, test cases, etc.) and analyse them from the perspective of technical debt liability, considering the targeted hardware platform and the quality requirements provided. The tools will provide reports highlighting deficiencies, ranked by importance, taking the change log and probability of future maintenance into account.

Fully autonomous vehicles and robotic surgery machines have enormous potential to change society. However, the combination of safety, security & privacy of connected and automated systems is still a concern in multiple application domains for many consumers in Europe. As the trust to adopt these technologies is not yet here for many potential users, the industry and research communities need to work on an answer to ensure that these concerns are no longer roadblocks for further evolution in the transport and medical sectors. SECREDAS will develop software for validating architecting methodologies, reference architectures, components and suitable integration, as well as verification approaches for automated systems in different domains.

Enable of CMOS Semiconductor technology to migrate to the next generation (Moore's Law).

SENSATION develops technologies and improves building blocks for the next generation of CMOS image sensors, image sensor interface standards, video processing, compression and transmission.

SERENE-IoT (Secured & EneRgy EfficieNt health-carE solutions using IoT technologies.) project aims at contributing to develop high quality connected care services and diagnosis tools based on Advanced Smart Health-Care IoT devices enabling a good level of healthcare quality of service for patients remotely followed by professional caregivers, all at much lower cost than the traditional care provided today.

Ultra sound application for gesture recognition for smart homes, automotive and under water.

More than Moore, 3D high density, and System-in-Package technologies are prerequisites for compact system integration. SiPoB-3D (Co-Design for System-in-Package-on-Board) aims at building up a design methodology for 3D integrated systems, which includes chip, package, and board domain. Both the design of a compact system and the understanding of the physics of the applied technologies and materials are focus. Data transfer between the three different domains is investigated. Target is a global optimum on chip, package and board level.

Smart4Europe aims to provide support in reinforcing the collaboration between projects supported under the SmartAnythingEverywhere Initiative especially in increasing their outreach and impact as well as providing wide coverage of stakeholders in technological, application, innovation, and geographical terms.

This booth is dedicated to success stories for ECS at the end of the value chain. At the booth products and prototypes will be showcased that were granted the Collective European Union Trademark Smart Systems Integrated®. The aim is to give visibility to ECS and more particularly to Smart Systems that are integrated into a wide breadth of products and would otherwise not be noticed by end users. These products range from a smart waste bin to an electronic parking brake or a propulsion control unit. The respective companies, most of them SMEs active in end user markets, will be available at the booth to explain, demonstrate and discuss their products, as well as related research and business opportunities.

Wafers for Automotive and other Key applications using Memories, embedded in Ulsi Processors